| 摘要 |
<p>PURPOSE:To provide a semiconductor wafer fixing adhesive tape which is kept high in rubbery elasticity even to a heavy stress, capable of expanding enough a space between chips as kept free from necking, and furthermore prevents adhesive agent from adhering to pins when a pick-up operation takes place. CONSTITUTION:An adhesive agent layer 2 is formed on a base film 3 for the formation of a semiconductor wafer fixing adhesive tape 1. The base film 3 is made of terpolymer composed of ethylene, methacrylic acid, and (metha) acrylic acid alkyl ester, wherein an ethylene content of a ternary copolymer is more than 60% by weight, and a number of carbons of an alkyl part of (metha) acrylic acid alkyl ester component is larger than 3 but smaller than 8.</p> |
