发明名称 COATING COMPOSITION FOR MOLDING IN-MOLD COATING
摘要 PURPOSE:To obtain a coating composition for molding an in-mold coating capable of providing a coated molding having a coating layer excellent in impact resistance and adhesion according to a method for molding the in-mold coating. CONSTITUTION:This coating composition for molding an in-mold coating is a thermosetting resin composition used as a coating material in a method for molding the in-mold coating so as to form a coating layer on a molding material in a forming mold. The composition comprises an epoxy resin and a nitrogen- containing curing agent for the epoxy resin or a polycarboxylic acid or a polymercaptan as principal components, as necessary, a polyisocyanate or a blocked isocyanate or the epoxy resin, nitrogen-containing curing agent for the epoxy resin, polycarboxylic acid or polymercaptan, a silane coupling agent having the chemical reactivity with the epoxy resin or the curing agent and an inorganic filler composed of a scaly inorganic filler, a mineral having >=5 Mohs hardness or an inorganic color pigment, etc.
申请公布号 JPH07228667(A) 申请公布日期 1995.08.29
申请号 JP19940021012 申请日期 1994.02.18
申请人 SEKISUI CHEM CO LTD 发明人 MORISHITA NATSUKI;TSUJI TOSHIMITSU
分类号 B29C43/20;B29K63/00;B29K105/06;C08G18/58;C08G59/40;C08G59/42;C08K3/00;C08K5/09;C08K5/16;C08K5/29;C08K5/37;C08K5/54;C08L63/00;C09D175/00;C09D175/04;(IPC1-7):C08G59/40 主分类号 B29C43/20
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