发明名称 MULTILAYER METAL LEADFRAME AND METHOD FOR MAKING SAME
摘要 A fabrication method and leadframe construction in which the leadframe is formed by selectively removing portions of a multilayer clad strip to expose a selected pattern of a conductive metal, such as aluminum, to conform to the desired application of the leadframe.
申请公布号 CA2125381(A1) 申请公布日期 1995.08.29
申请号 CA19942125381 申请日期 1994.06.07
申请人 TECHNICAL MATERIALS, INC. 发明人 MENNUCCI, JOSEPH P.
分类号 H01L23/50;H01L21/48;H01L23/495;(IPC1-7):H01L23/485 主分类号 H01L23/50
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