发明名称 |
MULTILAYER METAL LEADFRAME AND METHOD FOR MAKING SAME |
摘要 |
A fabrication method and leadframe construction in which the leadframe is formed by selectively removing portions of a multilayer clad strip to expose a selected pattern of a conductive metal, such as aluminum, to conform to the desired application of the leadframe. |
申请公布号 |
CA2125381(A1) |
申请公布日期 |
1995.08.29 |
申请号 |
CA19942125381 |
申请日期 |
1994.06.07 |
申请人 |
TECHNICAL MATERIALS, INC. |
发明人 |
MENNUCCI, JOSEPH P. |
分类号 |
H01L23/50;H01L21/48;H01L23/495;(IPC1-7):H01L23/485 |
主分类号 |
H01L23/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|