Process for reinforcing a semiconductor wafer

摘要

A process is used for reinforcing a semiconductor wafer, where remaining bubbles in a hot-melt adhesive can be reduced in number and in size. A reinforced wafer adhering to a reinforcing plate with a heated and softened adhesive is kept in a lower ambient pressure than a standard atmosphere for a predetermined period for deaeration, and is cooled under a higher pressure than the deaeration pressure. A reinforcing plate has a groove on its adhering face.