| 摘要 |
<p>PURPOSE:To improve the heat radiating property, reduce the thickness, preventing the resin from being peeled off, etc., in a module for an IC card. CONSTITUTION:A wiring pattern 6 is formed on one side surface of a rectangular substrate 1, and an external contacting terminal 7 is formed on the other side surface. The wiring pattern 6 is connected to the external contacting terminal 7 via a through hole bored in the substrate 1. An IC chip 2 is placed at a center of the substrate 1, and a pad (contact terminal) 21 on a lower surface the IC chip 2 is abutted against the wiring pattern 6 via the bump 4 and silver paste 5. A gap between the IC chip 2 and the substrate 1 is filled with resin 3. Since an upper surface of the IC chip 2 is not covered with the resin 3, a heat radiating property of the IC chip 2 can be raised.</p> |
