Components are soldered to a base by heating the base (23) to a temp (d) below the melting point of the solder (Q1) then heating the solder, the contacting surface of the base and the components to a second temp. at which the solder melts and a joint arises. Finally the joint is cooled to a temp. of (Q1) or below.
申请公布号
DE4405784(A1)
申请公布日期
1995.08.24
申请号
DE19944405784
申请日期
1994.02.23
申请人
DAIMLER-BENZ AEROSPACE AKTIENGESELLSCHAFT, 80804 MUENCHEN, DE