发明名称 PACKAGED INTEGRATED CIRCUIT WITH REDUCED ELECTROMAGNETIC INTERFERENCE
摘要 <p>A packaged integrated circuit ('IC') with reduced radiation of and susceptibility to electromagnetic fields includes three pins for power supply (e.g. VDD or VCC) and ground connections among a group of signal pins along a side of the IC package. In one embodiment, the power supply connection uses one pin while the ground connection uses the two adjacent pins on either side thereof. In another embodiment, the ground connection uses one pin while the power supply connection uses the two adjacent pins on either side thereof. Within the IC, the power supply and circuit ground conductors integrated therein form a supply current loop and a return current loop, respectively, which are closely spaced, and substantially symmetrical and coplanar. The directions of flow of the supply currents and return currents oppose each other, thereby creating opposing and substantially self-cancelling electromagnetic fields.</p>
申请公布号 WO1995022839(A1) 申请公布日期 1995.08.24
申请号 US1994008115 申请日期 1994.08.18
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