| 摘要 |
This invention relates to the production of trans- parent, shape-memorizing resin films by curing with radiation. The resin film composition comprising: (a) an oligomer compound that has at least one acryloyl or methacryloyl group in the molecule and that has a glass transition temperature, Tg, of lower than 50° C. after polymerization; and (b) a low-molecular weight compound that has in its molecule one reactive double bond capable of polymerization with the oligomer compound (a) and that has a glass transition temperature, Tg, higher than 90° C. after polymerization; or (b') a mixture of two or more low-molecular weight compounds that have in their molecule one reactive double bond capable of copolymerization with the oligomer compound (a) and that have a glass transition temperature, Tg, higher than 90° C. after polymerization. |
