发明名称 |
COPPER FILM COATED SUBSTRATE AND METHOD OF FORMING COPPER FILM ON SUBSTRATE |
摘要 |
A copper film coated substrate includes a substrate and a copper film formed on a surface of the substrate. The copper film has an X-ray diffraction intensity of 2.0 cps/nm or more per unit film thickness at a crystal orientation (111) face of the copper film. A crystal orientation of a copper thin film is controlled by irradiating a surface of a substrate with inert gas ions before forming a copper thin film on the substrate by a physical vapor deposition process. A copper thin film is formed by irradiating a surface of a substrate with ions, and depositing a copper thin film on the irradiated substrate. In the ion irradiating step, an ion irradiation energy for a dosage of the irradiated ions is controlled, so that crystal is greatly grown to be orientated in a direction of copper (111) face with a less dosage of the irradiated ions. <IMAGE> |
申请公布号 |
EP0565766(A3) |
申请公布日期 |
1995.08.23 |
申请号 |
EP19920109570 |
申请日期 |
1992.06.05 |
申请人 |
NISSIN ELECTRIC COMPANY, LIMITED |
发明人 |
EBE, AKINORI;OGATA, KIYOSHI;NISHIYAMA, SATOSHI;KURATANI, NAOTO;OKAZAKI, TAIZO |
分类号 |
C23C14/20;C23C14/22;C30B23/02 |
主分类号 |
C23C14/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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