发明名称 SOLDERING APPARATUS
摘要 This invention provides an improved wave soldering apparatus that protects the molten solder and the components being soldered from exposure to ambient air while the solder is in a liquid condition. At the soldering station, which is enclosed in a controlled atmosphere chamber, all the liquid solder, pumps and other elements exposed to liquid solder are enclosed within the chamber. This eliminates the formation of dross which interferes with the soldering process and also with the operation of the solder pumps. The inlet and outlet paths from the chamber, through which the components pass, are extended both to exclude ambient air and to permit the components to cool in a controlled atmosphere.
申请公布号 CA2140843(A1) 申请公布日期 1995.08.23
申请号 CA19952140843 申请日期 1995.01.12
申请人 SUND, WILLIAM 发明人 SUND, WILLIAM
分类号 B23K1/008;B23K3/08;(IPC1-7):B23K1/08;H05K3/34 主分类号 B23K1/008
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