Plastic SMD package for a semiconductor chip.

摘要

The housing encapsulates a semiconductor chip (1) with a high frequency component or integrated switch having external wire connections (4) to conductor strips on it. The chip and the connections are carried by a system carrier (2,3). The carrier is a coplanar three band strip conductor with a HF inner conductor (3) and outer conductors (2) alongside and separated from the carrier. Within the housing (6) the outer conductors have a flat connector by which the chip is attached to the end of the inner conductor.