发明名称 SUBMERGED ACCOMMODATION OF SEMICONDUCTOR WAFER
摘要 <p>PURPOSE:To provide a method of accommodating a semiconductor wafer having completed polishing process into a cassette in the accommodation side and simultaneously submerging the wafer into the liquid such as the pure water. CONSTITUTION:There are provided a processing completion work water receiving tank for loading a semiconductor wafer W having completed the polish processing and a water flowing conduit 3 for moving a semiconductor wafer with the water flow arranged between the processing completion work water receiving tank and a cassette in the accommodation side. Moreover, provided are an accommodation side cassette 1 for accommodating one by one the semiconductor wafers having completed the polish processing to the upper surface of respective frame materials 1a provided in the vertical direction with a constant interval, an accommodation side elevator board 5 which is provided to freely go upward and downward with a lifting mechanism 4 for placing the accommodation side cassette 1, an accommodation side warter tank 6 for reserving a liquid for submerging the accommodation side elevator 5 with the accommodation side cassette 1 and a sensor 7 for detecting a semiconductor wafer W accommodated on the frame material 1a of the accommodation side cassette 1 with the water flow of the water flow conduit 3.</p>
申请公布号 JPH07226432(A) 申请公布日期 1995.08.22
申请号 JP19940035200 申请日期 1994.02.09
申请人 RAP MASTER S F T KK 发明人 HATANO KOICHI;TAKASHIMA SHINICHI
分类号 B65D81/22;B65D85/86;H01L21/304;H01L21/673;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65D81/22
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