发明名称 Flux for soldering and solder composition comprising the same and soldering method using the same
摘要 Flux for soldering comprising inorganic ion-exchanger and activator containing halogen atom, solder composition the flux and solder particles, soldering method comprising coating the solder composition on a portion for soldering, soldering method comprising coating flux containing activator on a portion for soldering, applying inorganic ion-exchanger to the portion and applying solder to the portion, and soldering method comprising mixing inorganic ion-exchanger with creamy solder to give mixture, coating the mixture on a circuit pattern of a wiring plate and heating the wiring plate. The flux for soldering and the soldering composition are excellent in metal ion-migration resistance, corrosion resistance, soldering property and storage stability, and can be preferably used without cleaning and the soldering methods can be preferably used in practical no-clean soldering methods.
申请公布号 US5443659(A) 申请公布日期 1995.08.22
申请号 US19940335348 申请日期 1994.11.03
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 NONOGAKI, MITSUHIRO;FUJINO, JUNJI;ADACHI, AKIRA;MURAKAMI, KOHEI;MORIHIRO, YOSHIYUKI;HAYASHI, OSAMU
分类号 B23K1/20;B23K35/22;B23K35/36;B23K35/363;H05K3/34;(IPC1-7):B23K35/34 主分类号 B23K1/20
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