发明名称 |
Flux for soldering and solder composition comprising the same and soldering method using the same |
摘要 |
Flux for soldering comprising inorganic ion-exchanger and activator containing halogen atom, solder composition the flux and solder particles, soldering method comprising coating the solder composition on a portion for soldering, soldering method comprising coating flux containing activator on a portion for soldering, applying inorganic ion-exchanger to the portion and applying solder to the portion, and soldering method comprising mixing inorganic ion-exchanger with creamy solder to give mixture, coating the mixture on a circuit pattern of a wiring plate and heating the wiring plate. The flux for soldering and the soldering composition are excellent in metal ion-migration resistance, corrosion resistance, soldering property and storage stability, and can be preferably used without cleaning and the soldering methods can be preferably used in practical no-clean soldering methods.
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申请公布号 |
US5443659(A) |
申请公布日期 |
1995.08.22 |
申请号 |
US19940335348 |
申请日期 |
1994.11.03 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
NONOGAKI, MITSUHIRO;FUJINO, JUNJI;ADACHI, AKIRA;MURAKAMI, KOHEI;MORIHIRO, YOSHIYUKI;HAYASHI, OSAMU |
分类号 |
B23K1/20;B23K35/22;B23K35/36;B23K35/363;H05K3/34;(IPC1-7):B23K35/34 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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