发明名称 |
Solid imaging pick-up element |
摘要 |
A solid image pick-up element has a pixel region, an output region located near the pixel region, and a field portion located remote from the pixel region, all of which are formed at un upper layer of a semiconductor substrate. The pixel region is provided with plural rows of light receiving portions for performing photoelectric conversion with respect to light received thereby. Between the plural rows of the light receiving portions are interposed transfer portions for transferring signals obtained through the photoelectric conversion. The output region is provided with an output portion for outputting the signals transferred from the transfer portions. The semiconductor substrate is covered with three dielectric films, and an opening is formed through two dielectric films at a location above the output portion.
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申请公布号 |
US5444277(A) |
申请公布日期 |
1995.08.22 |
申请号 |
US19940275072 |
申请日期 |
1994.07.13 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
NAKAI, JUNICHI;IMANAKA, YASUHIRO;AOKI, TETSURO;ISHIBE, SHOUICHI;WATANABE, TOORU |
分类号 |
H01L27/148;H01L29/768;H04N5/335;H04N5/369;H04N5/3722;H04N5/3728;H04N5/374;(IPC1-7):H01L27/14;G02F1/015 |
主分类号 |
H01L27/148 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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