| 摘要 |
PURPOSE:To manufacture the resin sealed semiconductor device having high radiating characteristics by arranging the first and second radiators opposite to both sides of a semiconductor element. CONSTITUTION:A room R self-containing the ends of a semiconductor element 30, leads 32 and wires 34 is formed of the first radiator 10, the second radiator 20, the first insulating part 40 and the second insulating part 44. This room R is blocked to the extent of preventing a resin from flowing in the room R when a resin sealed part 50 is to be molded. The resin sealed part 50 formed in the exposed state of the surfaces 14a, 24a of the first and second radiators 10 and 20 is structured so as to prevent the resin from flowing in the room R self-containing the semiconductor element 30. In such a constitution, the semiconductor element 30 as a main heat generating source is junctioned with the first radiator 10 as well as the second radiator 20 is arranged opposite to the first radiator 10 thereby enabling the high radiating effect to be achieved. |
