| 摘要 |
PURPOSE:To provide a method of mounting an IC chip to manufacture a reliable IC module with improved cooling efficiency at a high yield. CONSTITUTION:The surface 5b of a circuit board is selectively exposed through individual holes in an insulating layer 7. Input and output terminals 6a of an IC 6 are inserted into the holes, which are then filled with conductive material 8 so that the IC is connected to the circuit board electrically and mechanically. In this manner, the IC is mounted on the board with their terminals insulated electrically from one another, while reliable connection and heat radiation are maintained. Therefore, functional reliability is also improved. |
