发明名称 CERAMIC WIRING BOARD
摘要 <p>PURPOSE:To provide an element of a stable resistance value regarding an inner layer resistance which is formed by arranging a resistor inside a substrate for ensuring a wide mounting area of a surface of a ceramic multilayer board whereon a high-speed LSI is mounted. CONSTITUTION:Screen print is performed for RuO2, IrO2, RhO2 paste as a resistance element 1 and Ag or AgPd paste as a conductor wiring 3 in a multilayer board. In the process, an AgPd or AgPt barrier layer 2 is formed between the wiring conductor 3 and the resistance element 1. In the process, weight ratio of Ag incorporated in the barrier layer 2 is set lower than Ag incorporated in the conductor wiring 3. Diffusion of Ag constituting a wiring conductor into a resistor is restrained by the barrier layer 2 and a resistance value of a resistance element is much stabler than a conventional one.</p>
申请公布号 JPH07226587(A) 申请公布日期 1995.08.22
申请号 JP19940231755 申请日期 1994.09.27
申请人 NEC CORP 发明人 INATA KAZUHIRO;KIMURA HIKARI
分类号 H05K1/16;H01C17/28;H01L23/498;H01L23/64;H01L27/01;H05K1/09;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/16
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