发明名称 |
Method for conditioning a substrate for subsequent electroless metal deposition |
摘要 |
Substrates are activated for subsequent metallization by contacting the substrate with a electrolyte in which reducing agents which are electrochemically generated in the electrolyte. The reducing agents are sorbed by the substrate which is contacted with a seeding medium to dispose on the substrate seed, preferably palladium seed for subsequent electroless and electrolytic metallization. |
申请公布号 |
US5443865(A) |
申请公布日期 |
1995.08.22 |
申请号 |
US19920859594 |
申请日期 |
1992.03.23 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
TISDALE, STEPHEN L.;VIEHBECK, ALFRED |
分类号 |
C23C18/18;C23C18/20;(IPC1-7):B05D1/00 |
主分类号 |
C23C18/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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