| 摘要 |
PURPOSE:To simplify a constitution in a contact apparatus where lead terminals of a semiconductor package is electrically connected at the time of characteristic test. CONSTITUTION:A plurality of electrodes 24 are arranged at the surface of a ceramic substrate 23 corresponding to lead terminals of a semiconductor package to be electrically tested. Each electrode 24 is provided with a stepped portion. Each lead terminal of the positioned semiconductor package is placed in contact with the electrode 24 on the ceramic substrate 23. In this case, good contact can be realized by removing oxide films adhering to the lead terminal with the stepped portion on the electrode 24. |
