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发明名称
MOLDING DIE DEVICE
摘要
申请公布号
JPH07223225(A)
申请公布日期
1995.08.22
申请号
JP19940016434
申请日期
1994.02.10
申请人
TDK CORP;SUMITOMO HEAVY IND LTD
发明人
ISHIKAWA SOSUKE;HIRANO HIDEOMI;SHIMAZU MASAKI;YAMAYA KENJI
分类号
B29C33/04;B29C33/46;B29C45/26;B29C45/40;B29C45/73;(IPC1-7):B29C33/46
主分类号
B29C33/04
代理机构
代理人
主权项
地址
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