| 摘要 |
<p>PURPOSE:To increase the contact area of a substrate and a substrate supporting base to improve cooling efficiency and the temp. distribution characteristic on the substrate when the temp. under treatment is high and to decrease the contact area to facilitate attachment and detachment of the substrate when the temp. is low. CONSTITUTION:This mechanism has the substrate supporting base 1 to be placed with the substrate 5 to be treated in a vacuum environment. A contact part 4 of the substrate supporting base 1 which comes into contact with the substrate 5 is formed of a material which is so deformed that the contact area with the substrate increases in accordance with the temp. change during the treatment. For example, the material of the contact part is bimetals or a shape memory alloy.</p> |
