| 摘要 |
PURPOSE:To provide a polishing device free from a possibility of contaminating the internal space of a clean room even in the case of installation therein. CONSTITUTION:This device has a loading section 31 for delivering a semiconductor wafer 21 to be polished in such state as adjacent to a polishing section, to a top ring 11, and an unloading section 32 for receiving the polished semiconductor wafer 21 from the top ring 11. Also, the top ring 11 is movable on a turntable 12 and between the turntable 12 and the loading and unloading sections 31 and 32. In addition, the whole travel area of the top ring 11 including the polishing section and the loading and unloading sections 31 and 32 is concealed with a cover 17. Furthermore, an independent exhaust duct 19 communicated to the inside of the cover 17 is provided for introducing the air inside the cover 17 to the outside of the installation zone of a polishing device 10 via the duct 19, thereby keeping atmospheric pressure inside the cover 17 lower than atmospheric pressure in the installation zone. |
