| 摘要 |
The invention relates to a process for the production of printed circuit boards and film circuit boards from intermediates (Z), in which starting products (A) are used, which comprise plasma-etchable insulating material (2), coated on one or both sides with plasma etching-resistant conductor material (1, 3) and in this process in a first process stage openings (8, 8') are plasma-etched in the insulating material (2) in accordance with prepared openings (7, 7') in the conductor material (1, 3), so that projecting edges (9, 9') of the prepared openings (7, 7') are plasma back etched, so that the prepared openings (7, 7') and the openings (8, 8') are structured in planned back etched manner and then in a second process stage the projecting edges (9, 9') are chemically etched away, so that the prepared openings (7, 7') and the openings (8, 8') are structured in planned etch-back free manner, so that intermediates (Z) are formed for further plating on.
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