SEMICONDUCTOR CHIP PACKAGE AND ITS PREPARATION

摘要

PURPOSE: To eliminate a solder mask, etc., by a method wherein compositions containing 1st and 2nd components are provided between the solder region and carrier contact pad of a connection part to have a region made of material whose melting point is lower than the melting point of the solder region or the carrier contact pad further included in the connection part. CONSTITUTION: The composition of each solder ball 30 which contains a 1st component and the composition of the upper part of each solderable carrier contact pad 50 which contains a 2nd component and is formed on a polyimide chip carrier substrate 40 are so selected as to satisfy a certain specific requirement. That is, the compositions are so selected as to make the eutectic composition of the two compositions have a melting point lower than the melting points of the solder ball 30 and the contact pad 50 on the polyimide chip carrier substrate 40. As a result, any oxide layer covering the solder ball 30 and the contact pad 50 can be broken and a solder mask is not necessary and the connection without using the melting of the bulk of the solder balls 30 and solvent can be realized.