LEAD FRAME AND PROCESSING METHOD OF THE LEAD FRAME

摘要

PURPOSE:To provide a processing method of lead frame capable of forming cut off sidewalls with high shape precision and manufacturing high quality products as well as the lead frame manufactured by this method. CONSTITUTION:In order to form the lead frame 101 having plural inner leads 103 connecting to respective terminals of semiconductor chip and outer leads 104 connecting to the inner leads 103 out of metallic sheet 1, firstly, wasted plates 3 are laminated on both surfaces of the metallic sheet 1 so as to form a laminated body 2. Next, the laminated body 2 is collectively laser cut off by laser beams 31 so as to form at least a part of the inner leads 103 or outer leads 104. Furthermore, the laser cut off laminated body 2 is collectively etched away to be separated into respective metallic sheets 1.