| 摘要 |
A modular electromechanical press apparatus and method for using such an apparatus for trimming excess portions from a leadframe strip package having a semiconductor chip thereon and for forming leads of the leadframe extending from the semiconductor chip is disclosed. The apparatus provides an electric motor for driving a plurality of coupled shafts. Two of the shafts include flywheels for reducing the load on the motor once the shafts reach steady state rotational velocity. In addition, each of these two shafts are provided with a one stroke clutch, so that upon activation of the clutches, one shaft moves a leadframe strip into proper position, and the other shaft drives a tool at the proper time to execute the desired trimming or forming operation. The unique arrangement of the components of the apparatus provides maximum power in a minimum size unit that can easily be incorporated into an in-line system for producing semiconductor packages.
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