| 摘要 |
The quality of the housing and especially the connecting pins of electronic components (SMD components) must be checked. To this end, a device for imaging the components and, in general, for imaging a three-dimensional object is provided which comprises an image display device (16), and optical imaging device (12) with mirrors and a flash illuminating device (14). Several sides 2-1, 2-2, 2-3, 2-4 of the three-dimensional object (2) are shown simultaneously on a common image surface. To this end, the three-dimensional object (2) is positioned in an imaging region (6) and the various views are shown at the same time. Here, the imaging region (6) is arranged exponentially so that it lies outside every line of sight between the individual optical components of the imaging device (12) and outside every line of sight between the illuminating device (14) and the individual optical components of the imaging device (12). It is thus possible for three-dimensional objects (2) to pass through the imaging region (6) without changing direction and they are illuminated at the correct time by a flash in the illumination device (14) and the necessary individual images are produced. |
