发明名称 PLASTIC MOLDED SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To improve stability of lead terminals, prevent the lead terminals from bending, and exclude the change of distance between the lead terminals, by forming two notches at the tip, bending one by 90 deg. in the plane direction and bending the others in the opposite plane direction. CONSTITUTION:By an ordinary manufacturing method of a lead terminal 1, the lower part 3 of the lead terminal is soldered to a connection metal plate 4, and a semiconductor chip 2 is connected with the rear of the connection plate. In this case, the lower part 3 of the lead terminal is bent in the different direction. That is, the lower part 3 of the lead terminal is divided into two parts. One out of the divided parts is bent by 90 deg. in the plane direction, and the other is bent by 90 deg. in the opposite plane direction. Thereby the flat type lead terminal 1 can be restrained from bending, so that the distance between terminals can be kept constant. Hence the movement of lead terminals and the solder exfoliation can be prevented.</p>
申请公布号 JPH07221214(A) 申请公布日期 1995.08.18
申请号 JP19940028805 申请日期 1994.01.31
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 SUDA SHOJI;HASHIMOTO KIYOJI
分类号 H01L23/04;H01L23/48;(IPC1-7):H01L23/04 主分类号 H01L23/04
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