发明名称 SOLID EMISSION IMAGING DEVICE AND MANUFACTURE OF IMAGING DEVICE ARRANGE
摘要 PURPOSE: To provide a solid-state radiation imager wherein one dielectric layer can be removed from an assembled array. CONSTITUTION: A radiation imager includes an optical sensor array having a plurality of separately addressable pixels. Each pixel has a photosensor island and a thin-film transistor(TFT) 130 related to the photosensor island. The TFT 130 is so located as to electrically connect selected photosensor islands to a predetermined address line. In each pixel, a single common passivation layer 160 is located above the TFT 130 and the photosensor island and the layer 160 is brought into contact with both an external face of the TFT 130 and part of an external face of the photosensor island.
申请公布号 JPH07221279(A) 申请公布日期 1995.08.18
申请号 JP19940275444 申请日期 1994.11.10
申请人 GENERAL ELECTRIC CO <GE> 发明人 CHINNIEU UEI;ROBAATO FUOORESUTO KUASUNITSUKU;BURAIAN UIRIAMU GIAMUBATEISUTA
分类号 H01L21/77;H01L21/84;H01L27/12;H01L27/146;H01L27/15;H01L29/786;H01L31/10;(IPC1-7):H01L27/146 主分类号 H01L21/77
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