| 摘要 |
<p>PURPOSE:To prevent necking on expansion by allowing a base film to consist of a plurality of layers and the layer at the surface side where no adhesive mass layer of the base film is provided to contain a friction-reduction agent. CONSTITUTION:A base film 3 of an adhesive tape 1 for fixing a semiconductor wafer consists of four layers (3a, 3b, 3c, and 3d) and a polymer of polyorefin and thermoplastic elastomer is used for each layer. A friction-reduction agent is contained in a base resin of the layer 3d in contact with a press tool at the opposite side of the adhesive mass coating layer 3a where the adhesive mass layer 2 is formed out of the layer constituting the base film 3. Then, no necking phenomenon for reducing the friction at the friction part between the adhesive tape 1 and the press tool occurs on expansion, thus fully and uniformly expanding the distance between chips and easily recognizing the image on pick-up and hence preventing malfunction.</p> |
