| 摘要 |
PURPOSE:To prevent water or the like from intruding into a resin sealing part main body to provide a highly reliable semiconductor device. CONSTITUTION:In a semiconductor device formed by resin-sealing a semiconductor element mounted on a substrate 12, the outer edges of a resin sealing part 10 with the element sealed therein are located on the insides of the outer peripheral edges of the substrate 12 and a molded item runner 14a is adhered on the substrate 12 integrally with the part 10 from the part 10 to the vicinity of the end edge of the substrate 12 and is resin-sealed. The runner 14a is broken in the vicinity of the position of the end edge of the substrate 12 and is separated from the substrate. |
