| 摘要 |
PURPOSE:To electrically connect a board without restriction of a structure material by adhering a first board to a second board via an adhesive layer made of a resin thin film, forming a thin film structure of the second board formed in a thin film from a rear surface, mechanically connecting the first board to the structure via a supporting layer, and removing the adhesive layer. CONSTITUTION:A beam pattern 5 is formed on an Si board 4 by an RIE with a photoresist 101 formed on the board 4 by a photolithography method as a mask, and the resist 101 is then peeled as a second board. Then, after an adhesive layer 6 made of a PMMA resin thin film is formed on the glass board 1 of the first board, the second board is adhered to the first board by applying a pressure from the rear surfaces of the boards. Thereafter, after the second board is wet etched to a thin film, it is further etched by an RIE to form an Si beam 2. Then, the PMMA is etched by the RIE, the formed Al thin film is patterned to form a support, and the PMMA is removed. |
