发明名称 METALIZING METHOD OF SEMICONDUCTOR DEVICE
摘要 depositing an insulation film, a metal film and an antireflection film in turn; depositing a first oxide film on the antireflection film, and coating a photoresist thereon; etching the first oxide film using the photoresist pattern after patterning the photoresist by photo-etching process; depositing a second oxide film on the first oxide film pattern, and forming a side wall of the oxide film in sides of the first oxide film by etch back process; and etching the oxide film at a low etching rate and etching the antireflection film and metal film at a high etching rate using the first oxide film and the side walls of the oxide film as a mask so as to form the metal wire. The method improves a profile of the metal wiring.
申请公布号 KR950009285(B1) 申请公布日期 1995.08.18
申请号 KR19920012911 申请日期 1992.07.20
申请人 LG SEMICONDUCTOR CO., LTD. 发明人 PARK, RAE - HAK
分类号 H01L21/283;(IPC1-7):H01L21/283 主分类号 H01L21/283
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