发明名称 |
MANUFACTURE OF LAMINATED CERAMIC PACKAGE |
摘要 |
<p>PURPOSE:To reduce influence of thermal expansion and contraction of a film and to reduce size irregularities when smoothening a conductor pattern printed on a surface of a green sheet. CONSTITUTION:A conductor pattern 3 such as a wire bonding pattern and an inside wiring pattern is printed on a surface; a through hole is shaped; film 9a, 9b are positioned in upper and lower surfaces of the green sheet 1 with a through hole full of a conductor; a position of the green sheet wherein a wire bonding part 5 is formed through a film is partially pressurized; and a conductor pattern surface of a wire bonding part is smoothened. Thereafter, a green sheet is separated from a film, a plurality of partially pressurized green sheets 1 are laminated and the laminated green sheet is pressurized to manufacture a green sheet lamination body 8. Thereafter, it is cut and burned.</p> |
申请公布号 |
JPH07221454(A) |
申请公布日期 |
1995.08.18 |
申请号 |
JP19940033107 |
申请日期 |
1994.02.04 |
申请人 |
SUMITOMO KINZOKU CERAMICS:KK |
发明人 |
HIRASHITA KAZUKI;AOKI MASATAKA;KAMITAMARI MAKOTO;IKEDA TAKUJI |
分类号 |
H05K3/46;H01L23/12;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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