发明名称 MANUFACTURE OF LAMINATED CERAMIC PACKAGE
摘要 <p>PURPOSE:To reduce influence of thermal expansion and contraction of a film and to reduce size irregularities when smoothening a conductor pattern printed on a surface of a green sheet. CONSTITUTION:A conductor pattern 3 such as a wire bonding pattern and an inside wiring pattern is printed on a surface; a through hole is shaped; film 9a, 9b are positioned in upper and lower surfaces of the green sheet 1 with a through hole full of a conductor; a position of the green sheet wherein a wire bonding part 5 is formed through a film is partially pressurized; and a conductor pattern surface of a wire bonding part is smoothened. Thereafter, a green sheet is separated from a film, a plurality of partially pressurized green sheets 1 are laminated and the laminated green sheet is pressurized to manufacture a green sheet lamination body 8. Thereafter, it is cut and burned.</p>
申请公布号 JPH07221454(A) 申请公布日期 1995.08.18
申请号 JP19940033107 申请日期 1994.02.04
申请人 SUMITOMO KINZOKU CERAMICS:KK 发明人 HIRASHITA KAZUKI;AOKI MASATAKA;KAMITAMARI MAKOTO;IKEDA TAKUJI
分类号 H05K3/46;H01L23/12;(IPC1-7):H05K3/46 主分类号 H05K3/46
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