MANUFACTURE OF MULTILATER PRINTED WIRING BOARD

摘要

PURPOSE:To enable manufacture of a multilayer printed wiring board whose wiring freedom of an inner layer board is not restricted by a position of a plated through-hole by forming a plated through-hole electrically insulated through-an insulation material on the same core as an interstitial viahole. CONSTITUTION:A platied through-hole wherein copper foils of front and rear surfaces are electrically connected through a panel copper plating 9a is formed in an interstitial viahole formation position in a double-sided board wherein an inner layer board is to be formed. Then, an interstitial viahole 9 is filled with paste of insulation resin 8. A through-hole of a small diameter is shaped in a central part of the interstitial viahole 9 filled with insulation resin. After a panel copper plating is applied to an entire of four layers, conductor patterns 1 and 4 are formed. A four-layer board wherein required copper foils of front and rear surfaces are electrically connected by a plating through hole 10 is completed in this way.