| 摘要 |
PURPOSE:To decrease stepping error of wafer stage, to shorten the time required for evaluation and to decrease the number of sheets of wafers for evaluation in an evaluation method which evaluates various kinds of characteristics of an exposure device by driving a wafer stage. CONSTITUTION:The operation to expose mark images 15A, 16A to 15F, 16F for evaluation at an exposure EA/n respectively on shot regions 17A to 17F arranged in an X direction on the wafer with a correct exposure defined as EA is repeated n-times. The lateral deviation quantities of the mark images 15B to 15F for evaluation and the mark images 16A to 16E for evaluation in Y direction are measured. These quantities indicate the bending quantity of a moving mirror for Y-axis at which stepping errors are decreased. |
