| 摘要 |
<p>PURPOSE:To reduce cost and to improve reliability by preventing package cracks. CONSTITUTION:This multilayered lead frame is formed by sticking a metal plate 5 coated with an insulative adhesive layer 6 on a plurality of leads 3 connected to a semiconductor element via the insulative adhesive layer 6. A semiconductor device using this multilayer lead frame comprises a resin molding 2 so applied as to surround the multilayered lead frame, a semiconductor element 1 fixed on the metal plate 5 via a conductive adhesive 7, bonding wires 4 which connect a plurality of leads 3 to the semiconductor element 1, and the whole excluding a part of the plurality of leads 3.</p> |
