| 摘要 |
<p>PURPOSE:To remove the burrs of a synthetic resin, which are generated at the time of molding of a molded part, at low cost in a semiconductor component, which is formed by packaging the part of a semiconductor element by the molded part made of the synthetic resin. CONSTITUTION:In the case where a laser beam is emitted on the surface of a molded part 10 molded between section bars of a lead frame through punched window holes A1 for mask bored in a light-shielding masking plate A, a slit- shaped punched window hole A2 is bored in the plate A apart from the holes A1 and the laser beam is emitted on the boundary parts between the molded part and the section bars through this hole A2.</p> |
