Method of marking gold-plated lids of electronic components.

摘要

A method of forming a mark (20) of an article (10). The method comprises applying a metal component (48) to a carrier (26), the metal component (48) applied in the shape of a pattern (50); placing the metal component (48) proximate a base metal (18); and supplying heat such that the base metal (18) and the metal component (48) alloy.