Method for fabricating multilayer circuits.

摘要

Method for fabricating multilayer circuits on rigid substrates using conventional dielectric green tape and thick film conductive pastes whereby - an unpierced dielectric green tape (3) is laminated on an insulating substrate (1) provided with a conductive pattern (2) - vias (4) are forming in the dielectric tape (3). - vias (4) are filled with conductive metallizations. - conductive pattern (5) is applied to the dielectric tape (3). - the assembly is fired (eventually after each strep). - the sequence of streps is repeated until the desired number of circuit layers has been obtained.