| 摘要 |
<p>PURPOSE:To provide a wafer wherein it is possible to prevent that a foreign matter is produced when the outer circumferential part of the wafer is chipped and the bonded region of the outer shape line of the wafer to the removed part of the wafer such as an orientation flat is chipped and it is possible to prevent various kinds of other defects from being caused. CONSTITUTION:In a wafer, bonded parts 4 of the outer-shape line of the wafer to an orientation flat 2 are chamfered and worked and the outer circumferential part 3 of the wafer is chamfered and worked. Consequently, an acute-angle part or a bent part does not exists at bonded regions of removed parts for positioning use of the wafer to the outer-shape line of the wafer and at the outer circumferential part of the wafer. As a result, it is possible to remarkably reduce a defect caused when the acute-angle part or the bent part exists such as a defect by a foreign matter when the wafer is chipped, a defect in a conveyance operation or a defect by a resist film thickness.</p> |
