发明名称 |
Silicone encapsulated devices. |
摘要 |
<p>The addition of a low viscosity (2-100 centipoise) polysiloxane such as a polydimethylsiloxane to a two-part heat curable polysiloxane system substantially eliminates the formation of bubbles when such system is employed as a potting compound for encapsulating devices such as electronic devices.</p> |
申请公布号 |
EP0247492(B1) |
申请公布日期 |
1995.08.16 |
申请号 |
EP19870107214 |
申请日期 |
1987.05.18 |
申请人 |
AT&T CORP. |
发明人 |
CHING-PING, WONG |
分类号 |
C08L83/04;C08L83/05;C08L83/07;H01B3/46;H01L23/29;H01L23/31;(IPC1-7):C08L83/07 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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