发明名称 Polypropylene resin composition and method for coating molded products of the resin compositions.
摘要 A polypropylene resin composition comprises (A) a polypropylene, (B) an ethylene-propylene-diene terpolymeric rubber having a Mooney viscosity, ML1+4 (100 DEG C), ranging from 5 to 50 and an iodine value of not less than 15, the component (B) ranging from 10 to 50% by weight on the basis of the total weight of the components (A) and (B), and optionally (C) an inorganic filler in an amount ranging from 0 to 40 parts by weight per 100 parts by weight of the sum of the components (A) and (B). A coating method comprises the steps of applying a primer coating to a molded product obtained by molding the foregoing polypropylene resin compostion or irradiating the molded product with plasma without degreasing and washing the product with a halogen atom-containing organic solvent and then applying a top coat to the product. Another coating method comprises the steps of degreasing and washing a molded product obtained by molding the foregoing polypropylene resin composition and then applying a top coat to the product without applying a primer coating to the molded product or irradiating the molded product with plasma. The coated film obtained according to the foregoing methods has good bond strength to the molded product.
申请公布号 EP0447271(B1) 申请公布日期 1995.08.16
申请号 EP19910302300 申请日期 1991.03.18
申请人 MITSUI TOATSU CHEMICALS, INC. 发明人 NITTA, KATSUYUKI;SUEHIRO, KEIGO;KAWAI, YOICHI;SEKIGUCHI, KATSUMI;INOKUMA, TAKEAKI;KAMIYA, YOSHIYASU
分类号 B05D7/02;B29C59/14;C08J7/04;C08L23/10;C08L23/12;C08L23/16;(IPC1-7):C08L23/10;C08J3/28 主分类号 B05D7/02
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