| 摘要 |
PURPOSE:To prepare a multilayered adhesive sheet which is useful for making a multilayered circuit board excellent in dimensional stability to changing temp., heat resistance, and positional accuracy between circuit layers and which can be provisionally bonded, by constituting the adhesive sheet of specific layers. CONSTITUTION:The sheet in the title is made up of at least three adhesive layers, in which the outermost layers are respectively made of adhesive compositions 2A and 2B (e.g. an acrylic adhesive) having a lower bonding initiation temp. than the adhesive composition 1 (e.g. an imide adhesive) sandwiched between the compositions 2A and 2B. The film in the title comprises a polyimide film coated on the outer side with an adhesive composition (a) and on the inner side with another adhesive composition (b), the composition (a) having a lower bonding initiation temp. than the composition (b). |
