发明名称 HEAT-RESISTANT MOISTURE-PROOF VAPOR DEPOSITION FILM
摘要 PURPOSE:To produce a heat-resistant moistureproof vapor deposition film excellent in heat resistance and moisture proof by vapor depositing a metal on a biaxially oriented polypropylene film having specified thermal fusing temp. and crystallization degree to obtain specified thermal shrinkage and permeability for water vapor. CONSTITUTION:At least one surface of a biaxially oriented polypropylene film having >=165 deg.C peak temp. of thermal fusing temp. and >=50% crystallization degree is treated with corona discharge or plasma to deposit a metal (such as Al, Zn, Si) by vapor deposition. Thus, a film having <6 % total thermal shrinkage in the longitudinal direction and lateral direction when heated at 140 deg.C for 15min. and having <=1.0g/m<2>.24hr/20mum permeability of water vapor is obtd. The film has excellent heat resistance and moisture proof and good dimensional stability.
申请公布号 JPH07216537(A) 申请公布日期 1995.08.15
申请号 JP19940010988 申请日期 1994.02.02
申请人 TORAY IND INC 发明人 TANAKA SHIGERU;ASAKURA MASAYOSHI;UEHA ISAZUMI
分类号 B32B15/085;B32B15/08;C23C14/20;(IPC1-7):C23C14/20 主分类号 B32B15/085
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