发明名称 |
Polishing pad for chemical-mechanical polishing of a semiconductor substrate |
摘要 |
A mold is used to form a polishing pad, wherein the surface of the polishing side of the polishing pad is determined by a primary surface of the mold. Features along the polishing side of a polishing pad may take any one of several different shapes. Channels along the polishing side of the polishing pad allow a smaller pore size to be used. The mold allows more control over the surface of the polishing side, which in turn give more control over polishing characteristics.
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申请公布号 |
US5441598(A) |
申请公布日期 |
1995.08.15 |
申请号 |
US19930167008 |
申请日期 |
1993.12.16 |
申请人 |
MOTOROLA, INC. |
发明人 |
YU, TAT-KWAN;YU, CHRIS C. |
分类号 |
B23H5/08;B24B37/04;B24D13/14;(IPC1-7):H01L21/461 |
主分类号 |
B23H5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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