发明名称 |
Thermo-compression assembly/disassembly system for electric circuit board in inert ambience |
摘要 |
A thermo-compression tool incorproated in an assembly/disassembly system melts solder films of conductive leads of an electric circuit componet for bonding the conductive leads to pads of a circuit board, and nozzles blow high-temperature nitrogen gas to the conductive leads during the bonding work for preventing the solder films from oxidization.
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申请公布号 |
US5441194(A) |
申请公布日期 |
1995.08.15 |
申请号 |
US19930172613 |
申请日期 |
1993.12.22 |
申请人 |
YAMAHA CORPORATION |
发明人 |
NISHIMURA, SEIYA;MAEJIMA, YOSHIHISA;OHTA, TOKUYOSHI |
分类号 |
H05K3/34;B23K20/02;(IPC1-7):B23K3/00 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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