| 摘要 |
A photosensitive resin composition which is adapted for protecting articles and particularly, electronic parts, therewith comprises a polyimide precursor of the following general formula <IMAGE> a tetravalent organic group, each Y individually represents a divalent organic group, R1, R2 and R3 may be the same or different and represent a hydrogen atom or a monovalent organic group having form 1 to 10 carbon atoms, and p, q and m are, respectively, an integer of 1 or over, and a photosensitive diazoquinone compound.
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