| 摘要 |
An electroplating apparatus includes a casing having a large opening at the bottom, a substrate being electroplated in the casing, a plating solution injector penetrating through an upper part of the casing for introducing a plating solution into the casing, an exhaust port penetrating through an upper part of the casing for draining the plating solution, a vertically movable substrate stage disposed beneath the casing for holding the substrate and having an opening smaller than the substrate, and a spin chuck for carrying the substrate to the substrate stage. In this apparatus, initially, the substrate is put on the spin chuck. Then, the substrate stage moves up and closes the casing from the bottom, and the substrate is electroplated in the casing. After the electroplating, the substrate stage moves down, and the substrate is transferred to the spin chuck. Automatic transfer of the substrate is possible using a uniaxial robot that moves only in the vertical or horizontal directions.
|
