发明名称 |
Electrical lead for surface mounting of substrates |
摘要 |
A clip lead is provided for soldering to and supporting a first substrate vertically on a second substrate which may be horizontal. The terminal end of the clip is configured to form a stable support for the substrate during soldering in a vertical position to the second substrate by being bent at right angles to and extending under the first substrate.
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申请公布号 |
US5441430(A) |
申请公布日期 |
1995.08.15 |
申请号 |
US19940223716 |
申请日期 |
1994.04.06 |
申请人 |
NORTH AMERICAN SPECIALTIES CORPORATION |
发明人 |
SEIDLER, JACK |
分类号 |
H01R4/02;H01R12/04;H01R12/36;H05K3/34;H05K3/36;(IPC1-7):H01R4/02 |
主分类号 |
H01R4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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