发明名称 Electrical lead for surface mounting of substrates
摘要 A clip lead is provided for soldering to and supporting a first substrate vertically on a second substrate which may be horizontal. The terminal end of the clip is configured to form a stable support for the substrate during soldering in a vertical position to the second substrate by being bent at right angles to and extending under the first substrate.
申请公布号 US5441430(A) 申请公布日期 1995.08.15
申请号 US19940223716 申请日期 1994.04.06
申请人 NORTH AMERICAN SPECIALTIES CORPORATION 发明人 SEIDLER, JACK
分类号 H01R4/02;H01R12/04;H01R12/36;H05K3/34;H05K3/36;(IPC1-7):H01R4/02 主分类号 H01R4/02
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